TECHNOLOGY
Micro Cutting Process

Micro Cutting Process

(Low-Temperature Micro-Cutting Technology)

01.
In-house designed
low-temperature micro-cutting equipment
  • Disk system with upper/lower cooling water circulation
*Raw material input → Coarse grinding → Fine grinding → Ultra-fine powder discharge
  • One-step grinding process for producing
Low-temperature grinding equipment
02.

Advantages of Low-temperature Micro-Cutting Technology

  • Unlike cryogenic grinding at -196°C, low-temperature micro-cutting at 18°C minimizes changes in the powder's structure and functionality.
  • Production of ultra-fine powder (average particle size: 25 µm or less)
  • Particle size control through disk spacing and rotational speed
Low-temperature grinding
03.

Applications

  • Ultrafine wet grinding for paste production
    (sesame, almonds, walnuts, macadamia, cashews, pine nuts, and other nuts)
  • Raw materials with high lipid content, such as coffee beans
  • Ginseng and red ginseng powders (ultra-fine powder with an average particle size of 25 µm or less)
  • Tea, herbs, natural seasonings, and spices
  • Soybeans for whole tofu and soy milk production without okara by-products
  • Buckwheat flour, rice flour, and other grains that preserve natural flavor without protein denaturation
Application examples
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